Defect Metrology Process Devleopment Engineer

Position Summary: We are looking for a Defect Metrology Process Engineer for our Florida Advanced Packaging site. In this role, you will lead, develop, and improve AOI and Metrology processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management. Major Areas of Accountability: • Implement and maintain metrology support systems, such as add-on software packages and data collection archiving • Ensure metrology supports multiple fab areas with thickness and defect measurements, inspection of pillar heights and location, as well as AFM and profilometry. • Daily review of defects and SPC data for excursions, disposition and drive yield improvements in layout and process. • Coordinate with appropriate engineering areas to report die pad locations through automation in fan-out wafer level packaging applications. • Investigate and drive integration changes for improved device performance and yield improvement. • Work with process and tool engineers to find processing marginalities and make improvements. The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position. Required Qualifications: Education: Associate degree with prior semiconductor experience or BS, MS or PhD in Electrical Engineering, Electronics Engineering, or a related BS Engineering. Experience and Skills: Associates degree with 5+ years of process technician experience, 0+ years of experience with BS, MS, or PhD in Electrical Engineering, Electronics Engineering, or a related in the semiconductor industry. Fab processing tools knowledge/experience and how to support defect feedback to process owners. Prior Defect inspection experience. MEMS/CMOS/Packaging inspection and metrology knowledge with relevant combination of years of experience and/or advanced degree. Knowledge of DOE, SPC, and 6-sigma concepts and applications. Project Management skills and/or defined training a plus. Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes. Can work both independently and in cross-functional teams for problem solving. U.S. Person Required: This position requires compliance with the International Traffic in Arms Regulations (ITAR). All accepted applicants must be U.S. Persons. ITAR defines a U.S. Person as U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.