Failure Analysis Technician (Night Shift -B)
Coherent
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- Location
- Sherman, TX
- Job type
- Full time
- Posted
- Oct 19
- 3 days ago
Career path
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About the company
Coherent
Semiconductors · 10,001+ employees
What you'll do
- Requires an Associate Degree in Electronics, Materials Science, Engineering Technology, Physics, Chemistry, Microscopy, or a related technical field with 2+ years of relevant experience; or 4+ years of directly applicable experience in semiconductor failure analysis, microscopy, materials characterization, or a related laboratory environment.
- Hands-on experience operating Focused Ion Beam (FIB) or Dual-Beam FIB (DBFIB) systems required.
- Experience with TEM lamella preparation using in-situ lift-out techniques strongly preferred.
- Experience operating Scanning Electron Microscopes (SEM) and performing EDS elemental analysis preferred.
- Experience operating or supporting Transmission Electron Microscopes (TEM) preferred.
- Working knowledge of semiconductor device structures, thin-film materials, metallization systems, and failure mechanisms preferred.
- Ability to interpret SEM, TEM, EDS, and FIB-generated data and communicate observations clearly.
- Strong mechanical aptitude and manual dexterity for handling delicate samples and performing precision sample preparation.
- Ability to work with sub-micron features and maintain high attention to detail when preparing and analyzing specimens.
- Proficiency with Microsoft Office applications and technical report generation.
- Experience with image processing and annotation software such as Photoshop, ImageJ, or equivalent preferred.
- Self-motivated with the ability to manage multiple investigations simultaneously and prioritize work effectively.
- Strong written and verbal communication skills.
- Experience working in cleanroom, laboratory, or semiconductor manufacturing environments preferred.
- Strong interpersonal skills to be able to effectively collaborate with others including within department and cross-functional teams in order to achieve business unit and organizational objectives.
- Work in a class 10,000 clean room for extended periods.
- Wear cleanroom attire (smock, frocks, mask, etc.)
- Work with and/or around chemicals (such as IPA and Acetone).
- Manual dexterity sufficient to grasp, manipulate, and position very small objects (approximately 85 µm in diameter) using tweezers and other precision tools.
- Close visual acuity, with or without corrective lenses, required for activities including preparing and analyzing data; reading and interpreting figures; focusing and viewing microscopic images; visual inspection of small parts and defects; operating precision positioning probes; using measurement devices; and performing assembly or destructive analysis at close viewing distances.
- Ability to distinguish colors to identify defects, features, or conditions on parts and materials.
- Ability to communicate effectively in spoken English, including clearly conveying detailed or important instructions to others in person or in group settings.
- Ability to hear and interpret sounds at normal speaking levels, with or without correction, and to receive detailed information through oral communication.
- Ability to work at a microscope, which may require bending forward at the waist or spine for periods of up to one hour at a time.
- Ability to perform sedentary work, involving sitting and/or standing for up to four hours at a time while working at a workstation, microscope, or solvent hood.
- Ability to walk within the facility, including distances of up to approximately 500 meters, sometimes while wearing required protective footwear or shoe covers.
- Ability to perform light physical work, including lifting, carrying, or moving objects weighing up to 25 pounds over short distances.
- Ability to ascend and descend stairs and ladders as required.
- Ability to occasionally kneel or crouch to reach items below workstations or within equipment enclosures.
- Ability to perform precision manual probing, using both hands and arms, for periods of up to one hour at a time.
- Ability to work safely in environments with potential hazards, including proximity to moving mechanical parts that may present pinch hazards and exposure to chemicals.
- Ability and willingness to wear required cleanroom attire, including gowns and personal protective equipment, for periods of up to four hours at a time.
Key skills
focused ion beam (FIB)dual-beam FIB (DBFIB)scanning electron microscopy (SEM)energy-dispersive X-ray spectroscopy (EDS)transmission electron microscopy (TEM)
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Read the full posting here
Job Summary: A Failure Analysis Technician is responsible for performing advanced physical failure analysis of semiconductor and photonic devices using focused ion beam (FIB), dual-beam FIB (DBFIB), scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), and transmission electron microscopy (TEM) techniques. This role supports engineering investigations by preparing high-quality cross-sections and TEM specimens, collecting analytical data, documenting findings, and maintaining laboratory equipment and procedures. The technician works closely with Failure Analysis Engineers to identify failure mechanisms, characterize defects, and support product reliability and manufacturing improvement efforts.