Packaging Engineer Intern
MACOM
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- Location
- Milpitas, CA
- Work style
- On-site
- Job type
- Full time, Internship
- Posted
- Oct 13
- 4 days ago
Career path
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About the company
MACOM
Semiconductors · 1,001 to 5,000 employees
What you'll do
- Assist with package design and assembly drawings, collect data using metrology and failure analysis tools, and help design experiments and analyze results.
- Depending on skill level, run simulations, prepare reports, and present work to engineers and management.
Key skills
CAD softwareMetrologyFailure analysisStatistical techniquesProcess improvement methodologyFEA software packagesThermal simulationsMechanical simulations
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Read the full posting here
Packaging Engineer Intern
Job Description:
The packaging engineering group of MACOM supports the design, development, and implementation of packaging solutions for RF semiconductor devices. Interns may assist in package design work and in creating / reviewing assembly drawings using CAD software. They may collect data directly or coordinate work with external labs, using metrology and failure analysis tools and techniques. They may help design experiments and analyze results using statistical techniques and process improvement methodology. Interns may also, depending on skill level, run thermal and mechanical simulations with FEA software packages to characterize new materials and device designs. Interns will periodically need to put together reports of work and present to other engineers and management.