Photolithography Process Engineering Intern

RTP Semiconductor Process Engineering Intern – Photolithography and Metrology Role Overview: As a member of the Photolithography and Metrology process engineering team, the Process Engineering Intern will work alongside experienced engineers providing mentoring, guidance, and introductions to colleagues. This Internship with MACOM will help the Intern to gain valuable work experience in a key discipline, build professional relationships, and take ownership of a business-critical project. During the 12 weeks each Intern will: Be given an individual and well-defined project with set outcome goals Gain hands on experience Receive excellent training and ongoing supervision Be invited to attend an intern webinar series Attend networking/social events Attend and present at Poster Session about each Interns project successes and pitfalls Receive formal, written feedback Requirements: Currently enrolled in a Bachelor’s or Master’s degree in electrical engineering, materials science, or equivalent. Prerequisite Skills and Experience: Strong foundational knowledge of semiconductor fabrication processes and cleanroom protocols. Familiarity with process control concepts and statistical analysis. Excellent problem-solving skills and attention to detail. Ability to work independently and collaboratively in a fast-paced, team-oriented environment. Effective communication skills, both written and verbal. Additional Desirable Skills: Photolithography fundamental knowledge and/or experience in spin coat, expose, develop and the associated metrology Hands-on experience with semiconductor process equipment or lab-based process development. Experience with Statistical Process Control (SPC) tools and methodologies (e.g., control charts, Cp/Cpk analysis, DOE). Basic coding or scripting skills (e.g., Python, MATLAB, or R) to support data analysis and SPC automation. Familiarity with data visualization tools (e.g., JMP, Tableau, or Power BI). Understanding of Design of Experiments (DOE) and root cause analysis techniques (e.g., 5 Whys, Fishbone diagrams). Exposure to Six Sigma or Lean Manufacturing principles.