Process Engineer Rotational Program
3D Glass Solutions
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- Pay
- $75K to $100K
- a year
- Location
- Albuquerque, NM
- Work style
- On-site
- Job type
- Full time, Internship
- Posted
- Oct 16
- 3 days ago
Career path
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About the company
3D Glass Solutions
Electrical/electronic manufacturing · 51 to 200 employees
What you'll do
- Monitor production processes and use experiments, root cause analysis and data analysis to improve recipes, yield and process performance.
- Qualify tools and process changes, maintain process documentation, and support continuous improvement.
What you need
- Requires a bachelor's degree in Chemical Engineering, Mechanical Engineering, Materials Science, Physics or Chemistry; coursework or project experience in semiconductor processing; basic statistics and data analysis knowledge; and US citizenship.
- Must work on-site in a cleanroom and meet stated physical demands.
- Education: a bachelor's degree
Key skills
Semiconductor processingBasic statisticsData analysisWritten and verbal communicationCleanroom experienceSemiconductor metrologyDOESPCSix SigmaPythonMATLABRSQLJMP statistical software
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Perks
- sign-on bonus
- paid relocation
- equity
- Medical
- dental
- vision coverage
- paid time off
- tuition assistance
See full description on company page, apply now
Read the full posting here
About the program
3DGS is hiring new college graduates into a 24-month Process Engineering Rotational Program at our Albuquerque wafer fab. You will complete two 12-month rotations across process modules, then place into a permanent process engineering role based on your interests, performance and business needs.
Process engineers own the recipes, equipment performance and yield of the steps that turn bare glass into working chips. From your first week, you will work on live production problems with real impact on output, cost and quality.
Location: Albuquerque, NM (on-site)Level: 0-5 years of experience
Program length: 24 months, 2 rotations
Job type: Full-time, exempt
Compensation: $75,000 - $100,000 DOE
Rotation structure
Each rotation places you in a different process module with a dedicated mentor and a defined project.
Module/ What you'll work on/ Typical tools and methods
Photolithography
Critical dimension (CD) and overlay control, resist processes, reticle qualification
Exposure, tracks, overlay metrology
Etch
Wet etch recipe development, profile and selectivity control
Single and batch processing
Thin Films (CVD / PVD / ALD)
Film thickness, uniformity, stress and defect control
Deposition chambers, ellipsometry, XRF, stress gauges
Electroplating
Cu electroplating TSV or RDL
Single chamber electroplate tools, XRF, profilometry
Yield and Integration
Linking inline data and electrical test to defects and process shifts
Defect inspection, wafer maps, parametric test, statistical analysis
After your 2-year rotation, you will be placed in one of the modules based on your preference in combination of business needs.
What you'll do
Monitor process steps with statistical process control (SPC) and respond to out-of-control events on the production line.
Run designed experiments (DOE) to optimize recipes for yield, throughput, uniformity and defect density.
Investigate excursions and yield loss using root cause analysis methods such as 8D, 5 Whys and fishbone diagrams.
Qualify new tools, chambers, materials and recipe changes through formal change control.
Partner with equipment engineers, technicians, integration and yield teams to keep tools up and processes in spec.
Analyze large manufacturing datasets in JMP, Python, SQL or similar tools and present findings to engineering leadership.
Write and maintain process specifications, FMEAs, control plans and out-of-control action plans (OCAPs).
Support continuous improvement goals for cost, cycle time, safety and sustainability.
Required qualifications
Bachelor's degree in Chemical Engineering, Mechanical Engineering, Materials Science, Physics or Chemistry
Coursework or project experience in semiconductor processing.
Working knowledge of basic statistics and data analysis.
Clear written and verbal communication, including presenting technical results.
Ability to work on-site in a cleanroom environment, including occasional off-shift or weekend support during rotations.
Must be a US citizen
Preferred qualifications
Hands-on cleanroom or nanofabrication lab experience from university research, a co-op or an internship.
Familiarity with semiconductor metrology such as SEM, ellipsometry, AFM, XPS or four-point probe.
Exposure to DOE, SPC or Six Sigma methods.
Programming or scripting experience in Python, MATLAB, R or SQL.
Experience with JMP statistical software
What we offer
Compensation: Based on experience, sign-on bonus or paid relocation and equity.
Mentorship: A technical mentor in each rotation plus a program manager who supports you for the full 24 months.
Visibility: Regular project reviews with senior engineers and fab leadership.
Benefits: Medical, dental and vision coverage, IRA, paid time off and holidays, tuition assistance and relocation support.
Work environment and physical requirements
This role splits time between the cleanroom and the office. In the cleanroom you will wear full gowning (bunny suit, gloves, hood, safety glasses) for extended periods.
Stand and walk for several hours at a time and lift up to 25 lb (11 kg).
Follow strict safety and chemical handling procedures, including work near hazardous gases, chemicals and high-voltage equipment.
Reasonable accommodations are available for qualified individuals with disabilities.
3DGS participates in E-Verify to confirm employment eligibility.
https://www.everify.gov/sites/default/files/everify/posters/IER_RightToWorkPoster%20Eng_Es.pdf
https://www.e-verify.gov/sites/default/files/everify/posters/EVerifyParticipationPoster.pdf