RFIC Packaging (Mechanical) Engineer

RFIC Packaging Engineer Job Description: Technical lead for RFIC package development, supporting NPI from concept through production release. This individual will provide direction to product and design engineers for optimum, cost effective packaging solutions as well as providing thermal design and analysis for IC package and system level physical designs. Package types include plastic molded leadframe packages, ceramic packages and metal packages for RF and Microwave IC’s. We are looking for an individual who has a proven track record of managing multiple product development programs in parallel and reducing to practice on schedule in a high volume manufacturing environment. Responsibilities: Technical lead for RF/microwave plastic, ceramic and metal packagesWork with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and qualityWork with vendors and internal engineering resources to establish and update design rules for packagingEstablish and implement robust assembly processes internally and at our contract manufacturersTroubleshoot IC packaging defects, then define and implement solutionsProvide supplier benchmarking and tracking data to drive backend technology roadmapWorking with Quality organization, characterize failure modes, and analyze as a function of packaging materials and processesProvide thermal modeling and application notes for new packages