Signal Integrity/Power Integrity (SI/PI) Design Engineer
Ciena
- Pay
- $98.6K to $157.4K
- a year
- Location
- New Jersey, United States
- Work style
- On-site
- Job type
- Full time
- Posted
- Oct 27
- 1 day ago
Career path
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About the company
Ciena
Telecommunications · 5,001 to 10,000 employees
As the global leader in high-speed connectivity, Ciena builds the critical infrastructure powering the AI era. We’re a technology company shaping the future of networking, guided by innovation, integrity, and collaboration.
What you'll do
- Lead the electrical package design for custom in-house photonic, analog, and digital ICs
- Simulate and optimize signal/power integrity and RF performance of the package design
- Drive and support definition of advanced package selection, new product BGA configuration and package structure
- Responsible for package/SIP layout, optimization, design verification and tapeout
- Interface and coordinate with cross-functional groups on package selection, feasibility analysis and design
- Understand trade-offs and constraints while optimizing silicon floor plan, bump and package pin out
- Interface and work with CMs and vendors for sourcing existing designs and future product development
What you need
- Bachelors in Electrical Engineering or Physics
- 2+ years hands on experience with IC package design
- Fluent in SI/PI and EM simulation tools such as SIWave, HFSS
- Thorough understanding of signal and power integrity fundamentals
- Masters or PhD in Electrical Engineering or Physics (preferred)
- Substrate design experience for RF, digital, high speed and mixed signal die (preferred)
- Proficient in Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) tools (preferred)
- Experience in package design electrical review, SI/PI analysis (preferred)
Key skills
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Perks
- medical
- dental
- vision plans
- company matching
- Employee Stock Purchase Program
- Employee Assistance Program
- company-paid holidays
- vacation time
See full description on company page, apply now