Thin Films Module Engineering - PhD Intern

Intel Corporation

Hillsboro, OROn-siteInternship
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Pay
$120.9K to $120.9K
a year
Location
Hillsboro, OR
Work style
On-site
Job type
Internship
Posted
Oct 20
1 day ago
Career path

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About the company

Intel Corporation

Semiconductor Manufacturing · 10,001+ employees

Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone.

• Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop

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Intel Corporation on LinkedIn

What you'll do

  • The intern will support the development and maintenance of thin film manufacturing processes and equipment within the semiconductor module.
  • They will collaborate with engineering teams to optimize process control, analyze data trends, and drive automation improvements.

What you need

  • Candidates must be currently pursuing a PhD in a relevant STEM discipline such as Physics, Chemistry, or Engineering.
  • Strong analytical skills, experience with software coding, and the ability to work in a cleanroom environment are required.
  • Education: a postgraduate degree

Key skills

Semiconductor manufacturingThin film processesEquipment troubleshootingEquipment maintenanceEquipment qualificationProcess controlData analysisPythonJMPAI toolsProblem-solvingSoftware developmentCommunicationDesign of experiment

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Perks

  • Competitive pay
  • Stock bonuses
  • Health insurance
  • Retirement programs
  • Vacation

See full description on company page, apply now

Read the full posting here
Job Details: Job Description: The Role and Impact As a Module Engineering PhD Intern, you will play a key role in developing and sustaining semiconductor manufacturing processes for a specific module. Your day-to-day responsibilities will include supporting equipment troubleshooting, performing maintenance and qualification activities, and collaborating with engineering teams to optimize process control methodologies. This role offers a unique opportunity to gain hands-on experience in semiconductor manufacturing while building essential skills for a future career in engineering. Business group You will join the Intel Foundry team, a dynamic and innovative group dedicated to delivering cutting-edge manufacturing solutions that drive Intel's technology forward. The team focuses on advancing semiconductor fabrication processes in areas such as Diffusion, Dielectrics, Implant, EPI, and FE Metals. As part of this group, you will contribute to Intel's mission of creating world-changing technology that enables global progress and enriches lives. What We Do As members of the Manufacturing Development and Customer Engineering (MDCE) team, we are responsible for improving process capability for multiple technology nodes (Intel 18A, Intel 3, Intel 12nm and upcoming technologies) from initial product qualification through high volume manufacturing. The focus will be on delivering yield improvement, performance enhancement, variation and cost reduction. Key Responsibilities Assist with the development and implementation of thin film manufacturing processes for a specific module within Intel's semiconductor production. Support troubleshooting and maintenance activities for manufacturing equipment to ensure optimal performance. Participate in equipment qualification processes, ensuring compliance with quality and functional standards. Collaborate with engineering teams to optimize process control methodologies and achieve production targets. Establish strong working relationships and partner closely with technology development, high volume manufacturing and cross-functional stakeholders to achieve common goals. Analyze data trends, identify solutions for process improvement and drive automation improvements (using AI where applicable) Contribute to sustaining and improving manufacturing tools and processes while gaining hands-on experience in semiconductor engineering. Qualifications: Minimum Qualifications Currently pursuing a PhD degree in a relevant STEM discipline (e.g. Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, Computer Science, etc.). Strong analytical and problem-solving skills. Experience writing software code for application in above majors Excellent communication skills - both written and verbal. Ability to work independently and as part of a diverse, high-performing team. Willingness to work in a cleanroom environment. Strong attention to detail and disciplined approach to procedures. Data analysis skills with demonstrated ability to construct clear data-based problem statements, design of experiment. Preferred Qualifications Experience with data analysis tools and software (e.g. JMP, Python, Excel, and AI tools). Ability to summarize data for technical and non-technical audiences. Please note, the ideal candidate will be open to work a 6-month internship schedule beginning the Spring of 2027 through December 2027. This is your chance to join a global leader in semiconductor manufacturing, gain real-world experience, and contribute to innovative solutions that shape the future of technology. If you are ready to learn, grow, and make an impact, we encourage you to apply today. Job Type: Student / Intern Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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