IC Design Intern

MACOM Technology Solutions Holdings, Inc.MACOM Technology Solutions Holdings, Inc.Milpitas, California, United States
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Posted

9/28/2026

Employment

Internship

Range

$20 - $47/hr

Work style

On-site

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AI summary

Core responsibilities

Design high-speed modulator drivers in SiGe technology, emphasizing high output drive and wide bandwidth. Communicate with MACOM personnel about design tradeoffs and progress, and document design and test results.

Requirements overview

Applicants must be PhD students with experience in analog IC design and layout, including use of Cadence design tools. They should communicate effectively, work independently and collaboratively, and demonstrate self-motivation and a strong sense of ownership.

Key skills

Analog IC DesignIC LayoutCadence Design ToolsSiGe TechnologyHigh-Speed Modulator Driver DesignHigh Output Drive DesignWide-Bandwidth DesignDesign Tradeoff AnalysisDesign DocumentationTest Results DocumentationCommunicationIndependent WorkTeamworkProject Ownership

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Education requirements

postgraduate degree

About MACOM Technology Solutions Holdings, Inc.

Industry

Semiconductors

Employees

2,221

Type

Public Company

Size

1,001-5,000 employees

MACOM designs and manufactures RF, microwave, millimeter wave solutions and optoelectronics for Data Center, Telecommunication, Industrial and Aerospace and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has more than 75 years of application expertise with multiple design centers, GaN, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities worldwide. In addition, MACOM offers foundry services that represents a key core competency within our business. MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

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Job categories

EngineeringTechnologyScience & ResearchManufacturing

Description

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks. MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates. Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure! Job Title: IC Design Intern Role Overview: This Internship with MACOM will help the Intern to gain valuable work experience in a key discipline, build professional relationships, and take ownership of a business-critical project. Job Description and Skills: • Design high speed modulator drivers in SiGe technology with emphasis on high output drive level and wide bandwidth • Communicate with Macom personnel to review tradeoffs and progress • Document design and test results During the 12 weeks each Intern will: • Be given an individual and well-defined project with set outcome goals • Gain hands on experience • Receive excellent training and ongoing supervision • Be invited to attend an intern webinar series • Attend networking/social events • Attend and present at Poster Session about each Interns project successes and pitfalls • Receive formal, written feedback Qualifications (including experience, education and skills required): • PhD Student • Experience in Analog IC design and layout • Experience using Cadence design tools • Good communication skills and ability to work independently as well as in teams • Self-motivated with strong sense of ownership The hourly Range for this position is $20 – $47 per hour. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates’ experience, education, and specific knowledge, skills, and abilities. EEO: MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law. Reasonable Accommodation: MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call +1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.

Requirements

  • •Analog IC Design
  • •IC Layout
  • •Cadence Design Tools
  • •SiGe Technology
  • •High-Speed Modulator Driver Design
  • •High Output Drive Design
  • •Wide-Bandwidth Design
  • •Design Tradeoff Analysis
  • •Design Documentation
  • •Test Results Documentation
  • •Communication
  • •Independent Work
  • •Teamwork
  • •Project Ownership

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