Software Engineering PhD Intern New 2027

Intel CorporationIntel CorporationHillsboro, Oregon, United States
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Posted

10/1/2026

Employment

Full time, Internship

Range

$150k - $150k/year

Work style

On-site

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AI summary

Core responsibilities

Design, develop, and optimize software solutions for engineering and research applications using numerical methods. Collaborate with multidisciplinary teams to develop modeling-based methodologies for semiconductor process and reliability problems.

Requirements overview

Must be a full-time PhD student in Electrical Engineering, Material Science, Mechanical Engineering, Chemical Engineering, or a related field. Requires at least one year of programming experience in C, C++, or Python and a minimum 3.0 GPA.

Key skills

Software engineeringCC++PythonNumerical methodsFinite element analysisTCADSemiconductor technologyPhysics-based modelingThermal managementSolid mechanicsAIMachine learningData analysisResearch

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Education requirements

postgraduate degree

About Intel Corporation

Industry

Semiconductor Manufacturing

Employees

109,902

Type

Public Company

Size

10,001+ employees

Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone. • Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop .

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Job categories

SoftwareEngineeringScience & ResearchTechnologyManufacturing

Description

Job Details: Job Description: The Role and Impact Intel is seeking a highly motivated Software Research Intern (PhD) to join the TCAD Process Reliability Modeling team within Intel Foundry. This internship offers an opportunity to work on advanced computational software solutions supporting semiconductor technology development. The selected candidate will contribute to cutting-edge software applications and solution methodologies like chip-package interactions, thermal transport and thermal management, thin films development and patterning. The internship is designed for PhD students interested in applying software engineering and research expertise to solve complex engineering challenges while collaborating with multidisciplinary teams across Intel. Business Group The Intel Foundry Technology organization is focused on driving semiconductor process innovation and enabling future technology nodes. Within the LTD-TD TCAD team, engineers and researchers develop advanced simulation, modeling, and software solutions used to accelerate technology development. The team fosters a collaborative environment where software, mathematics, physics, and engineering intersect to solve challenging technical problems. Key Responsibilities Design, develop, and optimize software solutions for engineering and research applications. Develop simulations capabilities using numerical methods like finite element, level sets, or related techniques. Develop modeling-based methodologies to solve device and interconnect process, module and reliability problems. Establish criteria and methods to determine proper inputs and validate results. Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions. Document technical solutions and present findings to project stakeholders. Qualifications: Minimum Qualifications Must be a full-time student pursuing a Ph.D. degree in Electrical Engineering, Material Science, Mechanical Engineering, Chemical Engineering or a semiconductor-related field. Must have a minimum of a 3.0 GPA in college courses to date. 1+ year experience programming in C/C++/Python or equivalent. Strong analytical, problem-solving, and software development skills. Preferred Qualifications Experience with using TCAD or atomistic simulation tools to study thermo-mechanical and chip/package interactions, thermal transport, thin film deposition processes, patterning, material chemical interactions or circuit performance. Hands on experience development and/or using finite element or equivalent solvers for solutions of physical systems. Experience with physics-based modeling, AI/machine learning methodologies for the analysis of solid mechanics, thermal management, reliability and manufacturing process of microprocessors devices. This is your opportunity to develop your expertise, gain hands-on experience, and make a meaningful impact within a collaborative environment that drives the future of technology. We look forward to seeing how your skills and passion will contribute to our innovative team. Job Type: Student / Intern Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $149,598.00-149,602.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. * ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Requirements

  • •Software engineering
  • •C
  • •C++
  • •Python
  • •Numerical methods
  • •Finite element analysis
  • •TCAD
  • •Semiconductor technology
  • •Physics-based modeling
  • •Thermal management
  • •Solid mechanics
  • •AI
  • •Machine learning
  • •Data analysis
  • •Research

Benefits

  • •Competitive pay
  • •Stock bonuses
  • •Health insurance
  • •Retirement programs
  • •Vacation

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